Die matrix expander DME-220

  • Handles wafers up to 8"
  • Motor driven ram with adjustable 75 mm stroke
  • Adjustable ram speed
  • Uniform wafer expanding in all directions
  • Motorized film cutter system
  • Workstage is heated up to 75 оС
  • Simple operaton and maintenance

 Установка формирования кассеты кристаллов DME-220

 

DME-220 is designed for wafer expanding after dicing to achieve consistent die separation distance. Wafer expanding makes pick-up operation easier and prevent edge chipping.

Specification: 
Wafer size, max, mm

8"

Ram stroke, max, mm

75

Workstage temperature, max, оС

75

Supply voltage

230 VAC 50Hz 10A

Dimensions, mm

540x380x180

Weight, kg

45