Die matrix expander DME-220
DME-220 is designed for wafer expanding after dicing to achieve consistent die separation distance. Wafer expanding makes pick-up operation easier and prevent edge chipping.
8" 75 75 230 VAC 50Hz 10A 540x380x180 45
Specification: Wafer size, max, mm Ram stroke, max, mm Workstage temperature, max, оС Supply voltage Dimensions, mm Weight, kg
230 VAC 50Hz 10A