Wafer dicing equipment
Dicing saw SATURN
Saturn dicing saw is designed for high precision dicing and scribing of a wide range of materials:
High quality dicing is provided by a rigid frame structure, precisely balanced air bearing spindle shaft and smooth feeding of workpiece.
Wafer mounter WM-200
WM-200 is designed for bubble-free film lamination onto wafers or square substrates. It is compatible with UV or regular films (automatic reeling and removing of protective backing is standard feature). The system incorporates easy changing vacuum chucks for various applications (soft touch, multi panel, etc.).
UV-Curing system UV-210
The UV-210 is designed to reduce adhesive strength of UV-sensitive tapes. It has a safe and reliable UV source with 365 nm wavelength. Lamp worktime is controlled by PLC to help operator replace lamps in time.
Die-matrix expander DME-220
DME-220 is designed for wafer expanding after dicing to achieve consistent die separation distance. Wafer expanding makes pick-up operation easier and prevent edge chipping.
Wafer cleaning system WCS-200
WCS-200 is designed for wafer cleaning after dicing. The system is available in two configurations: wafers up to 8” and wafers up to 12”. Wafer cleaning process is configured through user friendly touch screen display. User can program up to 50 recipes with 4 steps.
Metal sintered dicing blades have slow wear and high blade life. It is used in dicing following materials: alumina, glass, saphire, TiC, Ferrite, LTCC. Blade thickness varies from 35 microns to 250 microns, diamond grit size from 3 to 100 microns.