Wafer dicing equipment

 

Dicing saw SATURN - front view

 

 

 

 

Dicing saw SATURN

 

Saturn dicing saw is designed for high precision dicing and scribing of a wide range of materials:

 

  • Ceramic substrates
  • Quartz
  • Silicon wafers
  • GaAs
  • Ferrites
  • Lithium Niobate
  • MEMS
  • LED
  • Glass and many more.

     

High quality dicing is provided by a rigid frame structure, precisely balanced air bearing spindle shaft and smooth feeding of workpiece. 

 

 

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Wafer mounter WM-200

 

Wafer mounter WM-200

 

WM-200 is designed for bubble-free film lamination onto wafers or square substrates. It is compatible with UV or regular films (automatic reeling and removing of protective backing is standard feature). The system incorporates easy changing vacuum chucks for various applications (soft touch, multi panel, etc.).

 

 

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 Установка УФ-экспонирования UV-210

  

 

UV-Curing system UV-210

 

The UV-210 is designed to reduce adhesive strength of UV-sensitive tapes. It has a safe and reliable UV source with 365 nm wavelength. Lamp worktime is controlled by PLC to help operator replace lamps in time. 

 

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 Установка формирования кассеты кристаллов DE-220 мал

 

 

 

Die-matrix expander DME-220

 

DME-220 is designed for wafer expanding after dicing to achieve consistent die separation distance. Wafer expanding makes pick-up operation easier and prevent edge chipping.

 

 

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 Wafer cleaning system WCS-200

 

Wafer cleaning system WCS-200

 

WCS-200 is designed for wafer cleaning after dicing. The system is available in two configurations: wafers up to 8” and wafers up to 12”. Wafer cleaning process is configured through user friendly touch screen display. User can program up to 50 recipes with 4 steps.

  

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Алмазные диски 

 

Dicing blades

 

Metal sintered dicing blades have slow wear and high blade life. It is used in dicing following materials: alumina, glass, saphire, TiC, Ferrite, LTCC. Blade thickness varies from 35 microns to 250 microns, diamond grit size from 3 to 100 microns.

 

 

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