Wafer mounter WM-200
WM-200 is designed for bubble-free film lamination onto wafers or square substrates. It is compatible with UV or regular films (automatic reeling and removing of protective backing is standard feature). The system incorporates easy changing vacuum chucks for various applications (soft touch, multi panel, etc.).
|Vacuum chuck temperature, max, °C|
|Air pressure, min, MPa|
|Air consumption, L/min|
230 VAC 50 Hz