Wafer mounter WM-200

 

  • Handles 6”/8” workpiece frames
  • End and Circular blades for cutting film leftovers
  • Heated vacuum chuck for consistent lamination
  • Frame alignment pins
  • Magnets for holding frames during mounting
  • Backed or non-backed film lamination

 

 Wafer mounter WM-200

 

WM-200 is designed for bubble-free film lamination onto wafers or square substrates. It is compatible with UV or regular films (automatic reeling and removing of protective backing is standard feature). The system incorporates easy changing vacuum chucks for various applications (soft touch, multi panel, etc.).

Specification: 
Workpiece frames

6"/8"

Vacuum chuck temperature, max, °C

70

Air pressure, min, MPa

0,3

Air consumption, L/min

125 

Supply voltage

230 VAC 50 Hz

Dimensions, mm

440х700х300

Weight, kg

35